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Technology of packaging an integrated circuit while still part of the wafer

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  • IC封裝類型之一 (zh)
  • technology of packaging an integrated circuit while still part of the wafer (en)
  • فناوری بسته‌بندی مدار مجتمع درحالی که هنوز بخشی از ویفر است (fa)
  • Technologie zur Verpackung eines integrierten Schaltkreises, der noch Teil des Wafers ist (de)
  • és un procés en què els components d'encapsulat s'uneixen a un circuit integrat (IC) abans de tallar l'oblia. (ca)
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  • Wafer-level packaging (en)
  • ウエハーレベルCSP (ja)
  • Wafer-level packaging (it)
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