8155/8195/8295参数对比

原创已于 2023-06-27 15:40:54 修改 · 1.1w 阅读

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#嵌入式硬件

于 2023-04-04 09:54:47 首次发布

这篇文章提供了高通8155、8255和8295芯片的详细规格对比，涵盖了CPU、GPU、AI性能、ISP、VPU等多个关键领域的参数，展示了不同芯片在工艺制程、内存带宽、处理能力等方面的差异。

最新参数对比：8155/8255/8295参数对比

SoC Chipset Feature Comparison

Feature	SA8155P	SA8195P	SA8295P
Process	7 nm	7 nm	5 nm
Package	23 mm × 23 mm × 2.26 mm FCBGA+HS	15 mm × 20 mm × 1.90 mm FCBGA+HS	25 mm × 25 mm × 2.25 mm FCBGA+HS
BGA pitch	0.7 mm	0.4 mm	0.6 mm
AECQ	Grade 3	Grade 3	Grade 3
CPU	Qualcomm ® Kryo™ 485, 2 MB L3 1 x Gold prime core up to 2.419 GHz 3 x Gold cores up to 2.131 GHz 4 x Silver cores up to 1.785 GHz	Kryo 495, 4 MB L3 4 x Gold prime core up to 2.496 GHz 4 x Silver cores up to 1.766 GHz	Kryo 695, 8 MB L3 4 x Gold prime core up to 2.5 GHz 4 x Gold cores up to 2.05 GHz
DMIPS	105K	todo	220K
Memory	4 × 16 LPDDR4X; up to 2092.8 MHz	8 × 16 LPDDR4X; up to 2092.8 MHz	8 × 16 LPDDR4X; up to 2092.8 MHz
GPU	Qualcomm ® Adreno™ 640	Adreno 680	Adreno 695
AI/NSP	V66, 4 x Qualcomm ® Hexagon™ Vector eXtensions (Qualcomm ® Hexagon™ Vector eXtensions (HVX)), 1 x HCP, up to 1.459 GHz	V66, 4 x HVX, 1 x HCP, up to 1.459 GHz	V68, 4 x HVX, 2 x HMX, up to 1.4 GHz
DPU	Adreno DPU 895, 24 MP, DSC v1.1, up to 530 MHz	Adreno DPU 899, 40 MP, DSCv1.1, up to 530 MHz	Adreno DPU 1199, 64 MP, DSC v1.2, up to 600 MHz
Camera Processor	Qualcomm Spectra™ 380 ISP, 2.5 Gbps/lane, 40 Gbps total	Qualcomm Spectra 390, 2.5 Gbps/lane, 40 Gbps total	Qualcomm Spectra 395, 2.5 Gbps/lane, 40 Gbps total
VPU	Adreno VPU 554, decode 4k120, encode 4k60, concurrent 4k60/4k30 decode/encode	Adreno VPU 554, decode 4k120, encode 4k60, concurrent 4k60/4k30 decode/encode	Adreno VPU 665, decode 4k240, encode 4k120, concurrent 4k120 decode/encode
Audio	V66 512 KB L2 up to 1.459 GHz	V66 512 KB L2 up to 1.459 GHz	V66 2 MB L2 up to 1.459 GHz
Security	SPU230	SPU230	SPU250
Functional safety	Safety Element out of Context (SEooC) targeting assumed ASIL B use cases	Safety Element out of Context (SEooC) targeting assumed ASIL B use cases	Safety Element out of Context (SEooC) targeting assumed ASIL B use cases. Contains dedicated Safety Manager sub-system, with lock step core
Junction temp	-40°C to +105°C	-40°C to +105°C	-40°C to +115°C
Display - DP	4-lane DisplayPort v1.4 shared with USB 3.1 Gen 2	3 x 4-lane DisplayPort v1.4, 2x shared with USB 3.1 Gen 2 1 x 4-lane embedded DisplayPort v1.4b	3 x 4-lane DisplayPort v1.4, 1 x shared with USB 3.1 Gen 2 4 x 4-lane embedded DisplayPort v1.4b
Display - DSI	DSI D-PHY v1.2 4-lane DSI0 4-lane DSI1	DSI D-PHY v1.2 4-lane DSI0 4-lane DSI1	DSI D-PHY v1.2 4-lane DSI0 4-lane DSI1
Camera – CSI	CSI-2 v1.3 4-lane CSI0 4-lane CSI1 4-lane CSI2 4-lane CSI3	CSI-2 v1.3 4-lane CSI0 4-lane CSI1 4-lane CSI2 4-lane CSI3	CSI-2 v1.3 4-lane CSI0 4-lane CSI1 4-lane CSI2 4-lane CSI3
CCI-I2C	x4	x8	x8
Audio – LS-I2S	4 x 2 data lanes each 1 x 4 data lanes each	4 x 2 data lanes each 1 x 4 data lanes each	6 x 2 data lanes each 1 x 4 data lanes each
Audio – HS-I2S	3 x 2 data lanes each, receive only	3 x 2 data lanes each, receive only	5 x 2 data lanes each, receive only
Audio – TDM/PCM	4 x 2 data lanes each 1 x 4 data lanes each	4 x 2 data lanes each 1 x 4 data lanes each	6 x 2 data lanes each 1 x 4 data lanes each
Storage – UFS	2 lane UFS 2.1 gear 3 rate A	2 x 2 lane UFS 3.0 gear 4 rate A	2 x 2 lane UFS 3.1 gear 4 rate B
PCIe	1-lane PCIe 3 (RC) 2-lane PCIe 3 (RC/EP)	1 x 1-lane PCIe 3 (RC) 2 x 2-lane PCIe 3 (RC) 1 x 4-lane PCIe 3 (RC/EP)	1 x 1-lane PCIe 3 (RC/EP) 2 x 4-lane PCIe 3 (RC/EP)
Ethernet – RGMII/RMII	1 x with MDIO 1.8 V only	1 x with MDIO 1.8 V only	2 x with MDIO 1.8 V or 2.5 V
USB	1 x USB 3.1 Gen 2 shared with DisplayPort 1 x USB 3.1 Gen 2	2 x USB3.1 Gen 2 shared with DisplayPort 2 x USB3.1 Gen 2	4 x USB3.1 Gen 2 1x shared with DisplayPort 2 x USB2.0
Functional safety	-	-	20 SM-GPIOs 1 x SPI – master 1 x SPI – slave 2 x I2C – master 2-lane UART – master 4 x clock monitors 44 x voltage monitors 3 x on-board thermal monitors
Miscellaneous SPI I 2 C UART GPIO	26 x QUP SE (GPIO + SSC) Master and slave Master Host 174 GPIOs	26 x QUP SE (GPIO+SSC) Master and slave Master Host 190 GPIOs	32 x QUP SE (GPIO+SSC) Master and slave Master Host 228 GPIOs
PMIC	20 x GPIOs 3 x AMUX	30 x GPIOs 5 x AMUX	32 x GPIOs 7 x AMUX