Business News

Chip Industry Week In Review

 AI agents move deeper into chip design; China doubles down on AI compute and memory; chip supply chains tighten for equipment and critical material...
Published on September 25th,  2026 by The SE Staff

Chip Industry Week In Review

 Major memory deal; AI Infra Summit news; U.S. chip capacity plans; 2nm & below advances; Huawei's chip offensive; RoT solution for data centers and...
Published on September 18th,  2026 by The SE Staff

The Silicon Heartland Wants To Be America’s Next Chip Powerhouse

 Intel may be the marquee name, but materials suppliers, packaging hubs, and quantum startups will determine whether the region becomes a true semic...
Published on September 17th,  2026 by Brendan Heffernan

Chip Industry Week in Review

 12-inch high-NA EUV masks; Arm's edge AI push; Amkor's expansion; 3D memory; FeRAM startup makes waves; Qualcomm-AWS $60B custom silicon deal; Ayar...
Published on September 11th,  2026 by The SE Staff

Chip Industry Week In Review

 2D Tunnel FET; in-memory photonic computing; India's $13.4B Semicon 2.0; SEMICON Taiwan; PCIe 6/7 test; MediaTek deal; 300mm Si photonics; InP expa...
Published on September 4th,  2026 by The SE Staff

Chip Industry Week in Review

 Hot Chips AI HW wave; HBM vs HBC; capacity buildout; Infineon's latest buy; advanced packaging enablers; foundry report; ASIC security threats; IC ...
Published on August 28th,  2026 by The SE Staff

Chip Industry Week In Review

 New Micron lab; chip/AI price jump; multi-die monitoring; cryo links for quantum chips; interconnect RC bottleneck; 18A win; CPO roadmap; 2 new CEO...
Published on August 21st,  2026 by The SE Staff

Semiconductor Earnings Roundup: Revenue, Growth and Takeaways

 Company-by-company breakdown: Earnings across +80 semiconductor companies show AI-driven demand extending well beyond the usual suspects.
Published on August 18th,  2026 by Linda Christensen

Chip Industry Week In Review

 Lam Research and ASE expansions; data center shifts; CPO system architecture initiative; 2D-transistor interface solution; USENIX HW security; pate...
Published on August 14th,  2026 by The SE Staff

Chip Industry Week in Review

 SK hynix's $38B new fabs; memory density increases; 2026 chip industry revenue to hit $1.65T; imec metrology roadmap; MIT's self-assembled contacts...
Published on August 7th,  2026 by The SE Staff

Startups

Startup Funding: Q2 2026

 Plenty of cash for AI and its enablers; 80 startups raise over $6B.
Published on July 13th,  2026 by Jesse Allen

Startup Funding: Q1 2026

 Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.
Published on April 13th,  2026 by Jesse Allen

Startup Funding: Q4 2025

 More and bigger funding rounds for AI chips and AI for making chips; 75 companies raise $3 billion.
Published on January 19th,  2026 by Jesse Allen

Startup Tips To Get From Seed Funding To Series A, B, C

 Everyone has a bright idea about how to save power or boost performance, but how do you make sure your startup lasts the distance?
Published on October 16th,  2025 by Liz Allan

Chip Industry Startup Funding: Q3 2025

 Blowout quarter for AI and quantum; 75 companies raise $6 billion.
Published on October 6th,  2025 by Jesse Allen

Cognichip: Using AI To Speed Complex Chip Design

 Closing the gap between increased complexity and accelerating software innovation.
Published on July 15th,  2025 by Ed Sperling And Emma Riverso

Startup Funding: Q2 2025

 New architectures and manufacturing methods draw investors; 75 startups raise $1.9 billion.
Published on July 14th,  2025 by Jesse Allen

EDA Startups At DAC 2025

 New challenges and opportunities, many involving AI, spur the launch of new EDA startups.
Published on July 9th,  2025 by Jesse Allen

Baya Systems: Moving Data Faster

 Taking aim at AI bottlenecks based on NoC technology developed by NetSpeed Systems.
Published on June 17th,  2025 by Ed Sperling And Emma Riverso

Startup Funding: Q1 2025

 AI chips and data center communications see big funding; 75 startups raise $2 billion.
Published on April 2nd,  2025 by Jesse Allen

Chip Industry Stocks*

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Blog Reviews

Blog Review: Sept. 23

 Digital twins and thermal sensors; agentic AI workflows; physical AI needs new silicon; RF design changes.
Published on September 23rd,  2026 by Jesse Allen

Blog Review: Sept. 16

 First-silicon success falls; engineering capacity; minimum clock period; optimizing PyTorch; counterfeit electronics.
Published on September 16th,  2026 by Jesse Allen

Blog Review: Sept. 9

 Compute vs. energy scaling; adapting to AI; fab digital twin; mobile VLM.
Published on September 9th,  2026 by Jesse Allen

Blog Review: Sept. 2

 Shifting landscape of chip design; AI for 3D-IC; India boosts semiconductors; 6G roadmap.
Published on September 2nd,  2026 by Jesse Allen

Blog Review: Aug. 26

 GAA to CFET; prioritize communication, not compute; verification headwinds; scale-up networks; local AI; high-volume CPO.
Published on August 26th,  2026 by Jesse Allen

Blog Review: Aug. 19

 Memory tagging; digital twin of the Moon; packaging moves front-and-center; streaming sensor data.
Published on August 19th,  2026 by Jesse Allen

Blog Review: Aug. 12

 Early multiphysics; high-speed M-PHY; STCO for 3D-ICs; what EDA needs for AI; workload optimization.
Published on August 12th,  2026 by Jesse Allen

Blog Review: Aug. 5

 PSS 3.1 channels; reset domain crossing; physics becomes critical; feedforward control; latency vs. latency.
Published on August 5th,  2026 by Jesse Allen

Blog Review: July 29

 Rethinking AI compute; DFI 6; 3D-IC reliability; local AI in browser; surface prep and cleaning.
Published on July 29th,  2026 by Jesse Allen

Blog Review: July 22

 Securing physical AI; agents need feedback; 3D-IC security; chiplet interoperability; RF digital twins.
Published on July 22nd,  2026 by Jesse Allen

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